Meet the Team

We are seeking a skilled and driven ASIC Mechanical Engineer to join [Employer hidden — sign up to reveal] ASIC Group. In this role, you will focus on mechanical and thermomechanical simulations of ASICs and complex silicon packages. Your simulations will directly facilitate product design, ensure mechanical reliability, and accelerate time to market for high-performance [Employer hidden — sign up to reveal] systems.

You will collaborate with a globally distributed team across multiple time zones, contributing to innovative, simulation-driven design across packaging, reliability, thermal, and hardware engineering groups.

Your Impact

• Perform finite element analysis to evaluate thermal mechanical stress, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies.
• Simulate and analyze linear/nonlinear material behaviors, such as plasticity, creep, and viscoelasticity, relevant to solder joints, Copper, stiffener, and underfills.
• Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting.
• Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation.
• Support design optimization at early phase of product development and failure investigations by correlating FEA predictions with test data and field returns.
• Document and present analysis results, assumptions, and design recommendations in a clear, structured format.

Minimum Qualifications

• Bachelors + 7 years of related experience, or Masters + 4 years of related experience, or PhD + 1 years of related experience.
• At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages.
• Hands-on experience with 3D modeling, finite element analysis using ABAQUS or ANSYS.
• Flexibility to coordinate and communicate across different time zones, supporting global project teams in the US and Asia.

Preferred Qualifications

• 5+ years of experience in mechanical or thermomechanical simulation of semiconductors or electronics packaging systems.
• Familiar with CAD, GD&T with AUTOCAD, CREO and related industry standards (JEDEC, IPC, etc.).
• Experience in flip chips, 2.5D/3D advanced packaging, and/or heterogeneous integration technologies.
• Familiarity with material mechanical behavior and material characterization and working knowledge of reliability qualification of semiconductor packages.
• Proficiency in script-based automation for simulation to improve simulation efficiency and consistency.

Why [Employer hidden — sign up to reveal]?

At [Employer hidden — sign up to reveal], we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are [Employer hidden — sign up to reveal], and our power starts with you.